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What is Flexural Modulus in High Frequency PCB ? |
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1. Introduction to Flexural Modulus |
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In high-frequency PCBs, the flexural modulus is crucial. It’s a material mechanics parameter quantifying material rigidity, showing the inherent ability to resist bending under force. It dictates PCB stability, and insufficient modulus leads to bending, harming high-frequency signal transmission, which is vital especially in 5G. |
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2. Influencing Factors |
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Material properties and manufacturing processes matter. Different substrates vary in flexural modulus due to chemical and structural differences. In lamination, temperature and pressure directly affect it; improper settings can cause resin curing issues or structural defects, deviating the modulus from the ideal. |
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3. Improvement Measures |
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3.1Select Appropriate Materials
During the material selection stage, we should carefully distinguish among different substrate materials. For high-frequency PCBs with extremely high requirements for flexural modulus, such as those used in core equipment like 5G base stations, priority should be given to well-known high-frequency board materials like Rogers to provide solid physical support for high-frequency PCBs and ensure that the flexural modulus meets the standards.
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3.2 Precise Temperature Control
Accurate temperature control during lamination is essential. Utilizing high-precision equipment minimizes temperature variations, ensuring complete and uniform curing of the resin. This enhances the board's rigidity and optimizes the flexural modulus. |
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3.3 Reasonable Pressure Application
The application of pressure also requires fine adjustment. Through a combination of simulation analysis and actual testing, an appropriate pressure distribution pattern should be determined to avoid excessive or insufficient local pressure. Uniform and reasonable pressure can make the layers of the board bond tightly, reducing internal structural defects and effectively improving the flexural modulus. |
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4.RT/duroid 6006 PCB : Prominent in Tensile Modulus |
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Rogers RT/duroid 6006 PCB exhibits obvious advantages in tensile modulus, as evidenced by the following detailed description and data support.
RT/duroid 6006 laminate has a dielectric constant of 6.15 +/- 0.15 at 10 GHz/23°C. And RT/duroid 6006 substrate shows thermal stability with a Td exceeding 500°C in TGA, which ensures dependable performance even under extremely harsh operating conditions. |
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4.1 Advantages in Material Structure |
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RT/duroid 6006 high frequency PCB is a ceramic-filled PTFE composite material. This makes it more difficult for the material to generate cracks and deform under stress, thereby increasing its tensile modulus.
The woven glass fiber cloth used as a reinforcing material interweaves with the ceramic-filled PTFE resin system to form a stable three-dimensional network structure, which can transfer stress more effectively and further enhance the overall tensile modulus of the material. |
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4.2 Relatively High Tensile Strength Values |
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The ultimate tensile strength of RT/duroid 6006 PCB in the Y direction is 17.0 MPa (2,470 psi), and in the X direction it is 20.0 MPa (2,900 psi), which is at a relatively high level among high-frequency circuit materials. |
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4.3 Good Tensile Modulus |
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The tensile modulus of RT/duroid 6006 laminate is 3.56 GPa (517 ksi) in the Y direction and 4.32 GPa (627 ksi) in the X direction. A higher tensile modulus means that the material is less likely to deform during the stretching process, indirectly demonstrating its advantages in tensile strength. |
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4.4 Performance Advantages in Applications |
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In aerospace, fabricates high-frequency circuit boards for satellite & aircraft systems. It withstands forces & temp changes, ensuring board integrity for reliable operation.
In communication base stations, RT/duroid 6006 is used for components like power amp boards and filters. Its high tensile strength keeps these components intact against vibration and wind, boosting equipment life and stability. |
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5. RT/duroid 6006 Specifications |
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Category |
Details |
Standard Thicknesses |
- 0.025” (0.635mm) with a tolerance of ± 0.0015”
- 0.050” (1.270mm) with a tolerance of ± 0.0020”
- 0.075” (1.900mm) with a tolerance of ± 0.0030” |
Standard Panel Sizes |
- 10” × 10” (254mm × 254mm)
- 10” × 20” (254mm × 508mm)
- 18” × 12” (457mm × 305mm) |
Standard Claddings |
- ½ oz. (18µm) HH/HH
- 1 oz. (35µm) H1/H1 |
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6. Summary |
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In high-frequency PCBs, flexural modulus likes a "master manipulator" driving electronic product evolution. An invisible engine for electronics innovation, it supports miniaturization and intelligence, helping the industry move forward. |
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Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen, China, serving customers worldwide.
We are devoted to delivering high-frequency PCB products and solutions of the highest quality, along with customized service. Feel free to consult and contant at any time !
Visit https://www.bicheng-enterprise.com to learn more.
Unlock its full potential by contacting Vicky at v.xie@bichengpcb.com. |
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